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FusionAP Raises $2M in Pre-Seed Funding Co-Led by Vertex Ventures

GateNews
According to Vertex Ventures Southeast Asia and India, FusionAP, a Penang-based semiconductor startup focused on outsourced assembly and test packaging, has raised $2 million in pre-seed funding. The round was co-led by Vertex Ventures Southeast Asia and India and Southern Capital Group, with a matching grant from Malaysia's Ministry of Science, Technology and Innovation. The company was founded by Teng Chow Ooi, the first employee at Intel's advanced packaging plant in Penang, and Peter Chavart, who led the development of Intel packaging technologies EMIB and Foveros.
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