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Apple and Broadcom Sign $300B+ Deal to Produce Over 15B Chips in U.S. Through 2031

2026-07-08 13:49:42

According to BlockBeats, Apple and Broadcom announced a multi-year agreement on July 8 exceeding $300 billion to jointly design and manufacture custom ASIC chip components and wireless technologies. Under the deal, Broadcom will produce over 15 billion chips in the United States and invest $1.5 billion to expand its manufacturing facility in Fort Collins, Colorado, where it produces FBAR filters and advanced RF components essential for wireless communication in iPhones and Mac devices. The agreement extends through 2031 and represents the largest collaboration within Apple's previously announced $600 billion U.S. investment initiative.

Disclaimer: The information on this page may come from third-party sources and is for reference only. It does not represent the views or opinions of Gate and does not constitute any financial, investment, or legal advice. Virtual asset trading involves high risk. Please do not rely solely on the information on this page when making decisions. For details, see the Disclaimer.

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