Bluethink Signs Glass Through-Hole Advanced Packaging MOU with Intel

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According to PANews, Luozhan International (Hong Kong) Limited, a wholly-owned subsidiary of Bluethink Technology, signed a memorandum of understanding with Intel Corporation on July 24 to collaborate on glass through-hole (TGV) advanced packaging technology. The MOU covers cooperation in key processes including glass substrate microvias, high-precision laser machining, and metallized via deposition. Intel will provide architectural information, design-for-manufacturability guidelines, and verification methods. The agreement is valid for one year from the signing date and may be extended by mutual agreement.
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