Blueshift Tech and Intel Sign MOU for Advanced TGV Glass Substrate Packaging Technology on July 24

On July 24, 2026, Blueshift Tech and Intel formally announced the signing of a memorandum of understanding to jointly develop advanced packaging technology based on Through-Glass Via (TGV) glass substrates. The collaboration aims to combine their core advantages to address next-generation semiconductor advanced packaging needs driven by artificial intelligence and high-performance computing applications.

Under the agreement, Intel will provide semiconductor architecture solutions, design-for-manufacturability specifications, and standardized validation frameworks, while Blueshift Tech will leverage its expertise in precision glass processing, laser manufacturing, and mass production capabilities. The partnership will focus on TGV advanced packaging development and explore applications across AI PCs, data centers, smart equipment, and edge computing.